The 7015 Frameless Triangle DC Fan is a customized ultra-thin, miniaturized, and high-space-utilization heat dissipation component developed for ultra-narrow installation spaces and high-precision miniaturized equipment. The model number 7015 indicates its core dimensional parameters: a 70mm outer diameter and an ultra-thin 15mm thickness, which is far thinner than most conventional cooling fans of the same air volume level. The most distinctive feature of this fan is its frameless integrated design, which abandons the traditional bulky plastic outer frame, retaining only the core triangular fixed bracket and impeller movement structure, maximizing space saving and realizing zero-distance embedded installation of equipment.
The frameless structural optimization completely subverts the installation mode of traditional cooling fans. By removing redundant frame structures, the fan’s overall volume is reduced by 30% compared with framed fans of the same specification, which perfectly adapts to the ultra-narrow internal cavity of miniaturized equipment such as beauty instruments, portable electronic devices, small medical equipment, and miniature industrial controllers. The reserved triangular fixed hole position is precisely positioned, matching the customized mounting reserved holes of most small precision equipment on the market, enabling quick and firm installation without additional accessories, improving installation efficiency and reducing assembly costs.
In terms of performance configuration, the 7015 frameless triangular DC fan adopts a high-efficiency DC brushless motor, which features low power consumption, high rotational efficiency, and zero spark interference during operation. The brushless motor avoids the carbon brush wear problem of traditional brushed motors, realizing maintenance-free long-term operation. The finely optimized impeller blade design increases the effective air supply area, ensuring sufficient air volume and stable wind pressure despite the ultra-thin body. It can quickly take away the heat generated by the core chip, circuit board, and heating components inside the equipment, effectively avoiding local overheating and heat accumulation of miniaturized equipment.
Aug 10, 2026 
Chinese
CN
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